EP2AGX95EF35I3G vs EP2AGX95EF35C6 Vergleich
Detaillierter Direktvergleich von EP2AGX95EF35I3G von Intel und EP2AGX95EF35C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGX95EF35I3G | EP2AGX95EF35C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $280,00 | $398,00 |
| Series | Arria II GX | — |
| Logic Elements | 89,178 | — |
| Total RAM Bits | 6,839,296 | — |
| Number of LABs/CLBs | 452 | — |
| User I/O Count | 452 | — |
| Gehäuse | 1152-BBGA, FCBGA | 1152-ball FCBGA |
| Montageart | Surface Mount | Surface Mount (FCBGA) |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Versorgungsspannung | 0.9 V core, 1.1 V/1.2 V/1.5 V/1.8 V/2.5 V/3.0 V I/O | — |
| Transceiver Count | Up to 12 channels | — |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| DSP Blocks | 484 (18x18 multipliers) | — |
| Embedded Hard IP | PCI Express Gen1/Gen2 endpoint/root-port | — |
| Memory Interfaces | DDR3 SDRAM up to 800 Mbps, DDR2, QDR II+ | — |
| Process Technology | 40 nm TSMC | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Device Family | — | Arria II GX |
| Logic Elements (LEs) | — | 89,178 |
| Maximum User I/O Pins | — | 452 |
| Embedded Memory (Kbits) | — | 4,478 |
| Embedded 18x18 Multipliers | — | 612 |
| Number of Transceivers | — | 8 |
| Maximum Transceiver Data Rate | — | 3.75 Gbps |
| Speed Grade | — | -6 (mid) |
| Process Node | — | 40 nm |
| PCIe Hard IP | — | PCIe Gen1/Gen2 (x1/x4/x8) - per family datasheet |
| Betriebstemperaturbereich | — | Commercial (0C to 85C) per 'C' suffix |
| Configuration Modes | — | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |