EP2AGZ300FF35C3G vs EP2AGZ300FF35C4N Vergleich

Detaillierter Direktvergleich von EP2AGZ300FF35C3G von Intel und EP2AGZ300FF35C4N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ300FF35C3G EP2AGZ300FF35C4N
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.395,00 $1.350,00
Series Arria II GZ Arria II GZ
Logic Elements 300,000 298,000
Adaptive Logic Modules (ALMs) 119,088 —
Embedded Memory 17,133 Kbit —
DSP Blocks 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes [DATA_NEEDED: number of DSP blocks]
Transceivers 16 channels, up to 6.375 Gbps Multi-gigabit transceivers integrated
Hard PCIe Controllers Up to 12 (Gen2 endpoint/root-port) —
User I/Os 1,288 —
I/O Banks 12 —
Process Technology 40 nm TSMC 40 nm
Gehäuse FCBGA-1152 (35 mm) —
Package Family BGA (Flip-Chip) —
Temperature Grade Commercial (0 C to 85 C junction) —
Speed Grade 3 (mid-performance) —
Configuration Method Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel —
Hard Memory Controller DDR3 up to 800 MHz, DDR2, QDR II+ —
RoHS-Status Compliant Compliant (per Besenchips / DigiKey listing)
Logic Array Blocks (LABs) — 11,920
Embedded Memory (bits) — 18,854,912 (~17.9 Mbit)
User I/O Count — 554
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Core Voltage — 0.9 V
Package Type — 1152-BBGA, FCBGA (flip-chip)
Terminal Form — Ball
Package Code (JEDEC) — HBGA
Operating Temperature Grade — Commercial (C4 = 0C to +85C)
Configuration Memory — SRAM-based (volatile, requires boot device)
PLLs — [DATA_NEEDED: PLL count]
Lead-Free Status — Lead free (per Besenchips listing)
Montageart — Surface Mount
Maximum Operating Frequency — 500 MHz

Datenblätter & Ressourcen

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