EP2AGZ300FF35C3G vs EP2AGZ300FF35C4N 비교

다음의 상세 나란히 비교: EP2AGZ300FF35C3G 제조: Intel 및 EP2AGZ300FF35C4N 제조: Altera. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 EP2AGZ300FF35C3G EP2AGZ300FF35C4N
브랜드 Intel Altera
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 활성 Obsolete
재고 상태 In Stock In Stock
단가 (USD) $1,395.00 $1,350.00
Series Arria II GZ Arria II GZ
Logic Elements 300,000 298,000
Adaptive Logic Modules (ALMs) 119,088 —
Embedded Memory 17,133 Kbit —
DSP Blocks 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes [DATA_NEEDED: number of DSP blocks]
Transceivers 16 channels, up to 6.375 Gbps Multi-gigabit transceivers integrated
Hard PCIe Controllers Up to 12 (Gen2 endpoint/root-port) —
User I/Os 1,288 —
I/O Banks 12 —
Process Technology 40 nm TSMC 40 nm
패키지 FCBGA-1152 (35 mm) —
Package Family BGA (Flip-Chip) —
Temperature Grade Commercial (0 C to 85 C junction) —
Speed Grade 3 (mid-performance) —
Configuration Method Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel —
Hard Memory Controller DDR3 up to 800 MHz, DDR2, QDR II+ —
RoHS 상태 Compliant Compliant (per Besenchips / DigiKey listing)
Logic Array Blocks (LABs) — 11,920
Embedded Memory (bits) — 18,854,912 (~17.9 Mbit)
User I/O Count — 554
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Core Voltage — 0.9 V
Package Type — 1152-BBGA, FCBGA (flip-chip)
Terminal Form — Ball
Package Code (JEDEC) — HBGA
Operating Temperature Grade — Commercial (C4 = 0C to +85C)
Configuration Memory — SRAM-based (volatile, requires boot device)
PLLs — [DATA_NEEDED: PLL count]
Lead-Free Status — Lead free (per Besenchips listing)
실장 유형 — Surface Mount
Maximum Operating Frequency — 500 MHz

데이터시트 & 자료

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