EP2AGZ300FF35C4N vs EP2AGZ300FF35C3G Vergleich

Detaillierter Direktvergleich von EP2AGZ300FF35C4N von Altera und EP2AGZ300FF35C3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ300FF35C4N EP2AGZ300FF35C3G
Marke Altera Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.350,00 $1.395,00
Series Arria II GZ Arria II GZ
Logic Elements 298,000 300,000
Logic Array Blocks (LABs) 11,920 —
Embedded Memory (bits) 18,854,912 (~17.9 Mbit) —
User I/O Count 554 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Process Technology 40 nm 40 nm TSMC
Core Voltage 0.9 V —
Package Type 1152-BBGA, FCBGA (flip-chip) —
Terminal Form Ball —
Package Code (JEDEC) HBGA —
Operating Temperature Grade Commercial (C4 = 0C to +85C) —
Configuration Memory SRAM-based (volatile, requires boot device) —
Transceivers Multi-gigabit transceivers integrated 16 channels, up to 6.375 Gbps
DSP Blocks [DATA_NEEDED: number of DSP blocks] 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes
PLLs [DATA_NEEDED: PLL count] —
RoHS-Status Compliant (per Besenchips / DigiKey listing) Compliant
Lead-Free Status Lead free (per Besenchips listing) —
Montageart Surface Mount —
Maximum Operating Frequency 500 MHz —
Adaptive Logic Modules (ALMs) — 119,088
Embedded Memory — 17,133 Kbit
Hard PCIe Controllers — Up to 12 (Gen2 endpoint/root-port)
User I/Os — 1,288
I/O Banks — 12
Gehäuse — FCBGA-1152 (35 mm)
Package Family — BGA (Flip-Chip)
Temperature Grade — Commercial (0 C to 85 C junction)
Speed Grade — 3 (mid-performance)
Configuration Method — Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel
Hard Memory Controller — DDR3 up to 800 MHz, DDR2, QDR II+

Datenblätter & Ressourcen

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