EP2AGZ300FF35C4N vs EP2AGZ300FF35C3G 对比

详细并排对比 EP2AGZ300FF35C4N 出自 Altera 和 EP2AGZ300FF35C3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2AGZ300FF35C4N EP2AGZ300FF35C3G
品牌 Altera Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 有效
库存状态 有库存 有库存
单价(USD) $1,350.00 $1,395.00
Series Arria II GZ Arria II GZ
Logic Elements 298,000 300,000
Logic Array Blocks (LABs) 11,920 —
Embedded Memory (bits) 18,854,912 (~17.9 Mbit) —
User I/O Count 554 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Process Technology 40 nm 40 nm TSMC
Core Voltage 0.9 V —
Package Type 1152-BBGA, FCBGA (flip-chip) —
Terminal Form Ball —
Package Code (JEDEC) HBGA —
Operating Temperature Grade Commercial (C4 = 0C to +85C) —
Configuration Memory SRAM-based (volatile, requires boot device) —
Transceivers Multi-gigabit transceivers integrated 16 channels, up to 6.375 Gbps
DSP Blocks [DATA_NEEDED: number of DSP blocks] 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes
PLLs [DATA_NEEDED: PLL count] —
RoHS 状态 Compliant (per Besenchips / DigiKey listing) Compliant
Lead-Free Status Lead free (per Besenchips listing) —
安装类型 Surface Mount —
Maximum Operating Frequency 500 MHz —
Adaptive Logic Modules (ALMs) — 119,088
Embedded Memory — 17,133 Kbit
Hard PCIe Controllers — Up to 12 (Gen2 endpoint/root-port)
User I/Os — 1,288
I/O Banks — 12
封装 — FCBGA-1152 (35 mm)
Package Family — BGA (Flip-Chip)
Temperature Grade — Commercial (0 C to 85 C junction)
Speed Grade — 3 (mid-performance)
Configuration Method — Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel
Hard Memory Controller — DDR3 up to 800 MHz, DDR2, QDR II+

数据手册与资源

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