EP2AGZ300FF35I3G vs EP2AGZ300FF35C4N Vergleich

Detaillierter Direktvergleich von EP2AGZ300FF35I3G von Intel und EP2AGZ300FF35C4N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ300FF35I3G EP2AGZ300FF35C4N
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.230,00 $1.350,00
Family Arria II GZ —
Logic Elements (LE) 300000 —
Number of User I/O 554 (maximum) —
Number of Transceivers 8 —
Transceiver Data Rate Up to 6.375 Gbps —
Process Node 40 nm —
Betriebstemperatur -40C to +100 C (I3 industrial) —
Gehäuse 1152-ball FBGA (FF35) —
Montageart Surface Mount Surface Mount
Versorgungsspannung [DATA_NEEDED: core and I/O supply voltage values] —
Embedded Memory (Mbits) 16.4 —
DSP Blocks [DATA_NEEDED: number of DSP blocks] [DATA_NEEDED: number of DSP blocks]
PLLs [DATA_NEEDED: number of PLLs] [DATA_NEEDED: PLL count]
Memory Interfaces DDR3, QDRII+, RLDRAM II —
Configuration Method Serial, Parallel, JTAG —
RoHS-Status Compliant Compliant (per Besenchips / DigiKey listing)
MSL-Level 3 (168 hours) —
Lead-Free Yes —
Series — Arria II GZ
Logic Elements — 298,000
Logic Array Blocks (LABs) — 11,920
Embedded Memory (bits) — 18,854,912 (~17.9 Mbit)
User I/O Count — 554
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Process Technology — 40 nm
Core Voltage — 0.9 V
Package Type — 1152-BBGA, FCBGA (flip-chip)
Terminal Form — Ball
Package Code (JEDEC) — HBGA
Operating Temperature Grade — Commercial (C4 = 0C to +85C)
Configuration Memory — SRAM-based (volatile, requires boot device)
Transceivers — Multi-gigabit transceivers integrated
Lead-Free Status — Lead free (per Besenchips listing)
Maximum Operating Frequency — 500 MHz

Datenblätter & Ressourcen

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