EP2AGZ300FF35I3G vs EP2AGZ300FF35C4N 对比

详细并排对比 EP2AGZ300FF35I3G 出自 Intel 和 EP2AGZ300FF35C4N 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2AGZ300FF35I3G EP2AGZ300FF35C4N
品牌 Intel Altera
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 Obsolete
库存状态 有库存 有库存
单价(USD) $1,230.00 $1,350.00
Family Arria II GZ —
Logic Elements (LE) 300000 —
Number of User I/O 554 (maximum) —
Number of Transceivers 8 —
Transceiver Data Rate Up to 6.375 Gbps —
Process Node 40 nm —
工作温度 -40C to +100 C (I3 industrial) —
封装 1152-ball FBGA (FF35) —
安装类型 Surface Mount Surface Mount
电源电压 [DATA_NEEDED: core and I/O supply voltage values] —
Embedded Memory (Mbits) 16.4 —
DSP Blocks [DATA_NEEDED: number of DSP blocks] [DATA_NEEDED: number of DSP blocks]
PLLs [DATA_NEEDED: number of PLLs] [DATA_NEEDED: PLL count]
Memory Interfaces DDR3, QDRII+, RLDRAM II —
Configuration Method Serial, Parallel, JTAG —
RoHS 状态 Compliant Compliant (per Besenchips / DigiKey listing)
MSL 等级 3 (168 hours) —
Lead-Free Yes —
Series — Arria II GZ
Logic Elements — 298,000
Logic Array Blocks (LABs) — 11,920
Embedded Memory (bits) — 18,854,912 (~17.9 Mbit)
User I/O Count — 554
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Process Technology — 40 nm
Core Voltage — 0.9 V
Package Type — 1152-BBGA, FCBGA (flip-chip)
Terminal Form — Ball
Package Code (JEDEC) — HBGA
Operating Temperature Grade — Commercial (C4 = 0C to +85C)
Configuration Memory — SRAM-based (volatile, requires boot device)
Transceivers — Multi-gigabit transceivers integrated
Lead-Free Status — Lead free (per Besenchips listing)
Maximum Operating Frequency — 500 MHz

数据手册与资源

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