EP2AGZ300FH29C3G - Arria II GZ FPGA, 281 I/O, 780-HBGA | Intel
Teilenummer: EP2AGZ300FH29C3G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1780 | $17.800,00 |
| 100 | $1695 | $169.500,00 |
| 500 | $1610 | $805.000,00 |
| 1.000 | $1545 | $1.545.000,00 |
EP2AGZ300FH29C3G Übersicht
A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that lets engineers implement arbitrary digital circuits through configuration memory rather than fixed silicon. FPGAs sit at the top of the programmable logic hierarchy (FPGA -> PLD -> programmable logic -> digital IC) and are used wherever ASIC NRE costs cannot be justified, where time-to-market is critical, or where post-deployment field updates are required. The Arria II GZ series in particular extends this definition by integrating multi-gigabit transceivers and dedicated DSP blocks alongside general-purpose logic.
Key features include 300,000 logic elements, embedded transceiver support for multi-gigabit serial interfaces, embedded memory blocks distributed across the fabric, and dedicated DSP blocks for high-throughput signal processing. The 780-ball FineLine BGA package supports the high pin density required to expose the part's I/O and supply pins, and the speed grade 3 commercial bin balances timing margin and unit cost for non-extended-temperature deployments.
The Arria II GZ architecture is built on a 40 nm low-power process and combines 8B/10B-capable transceivers with the fabric's adaptive logic modules (ALMs) and M9K/M144K memory blocks, giving designers a heterogeneous compute fabric. The part supports common FPGA design entry through Altera/Intel Quartus II, with the device supported in both legacy Quartus II releases and the current Quartus Prime design software.
Typical applications include high-speed serial interface bridging, telecom backplane aggregation, video broadcast processing, and DSP-intensive test and measurement. The 281 user I/O count combined with the high LE count also makes it suitable for data-acquisition front-ends and protocol conversion cards in industrial and defense systems. As a logic-only FPGA on a 40 nm process, the device is commonly paired with DDR2/DDR3 external memory and external clock-generation PLLs for timing distribution.
When designing with this part, ensure the PCB land pattern is laid out for a 780-ball FineLine BGA with proper via-in-pad or microvia escape. Decoupling strategy should follow the Quartus II pin connection guidelines for the Arria II GZ family, and JTAG access must be reserved for boundary-scan and in-system programming. Designers moving from the older Stratix II GX family to the GZ family should revalidate their I/O assignments because pin functions differ between the two families.
This page synthesizes distributor stock, application notes, and drop-in speed-grade alternatives not found in the manufacturer datasheet alone, giving procurement and design engineers a single source for the part's commercial and engineering context.
Drop-in-Alternativen für EP2AGZ300FH29C3G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2AGZ300FH29C3G (gleiche Bauform und Footprint) – abweichend in Speed Grade, Package, Transceivers, Logic Elements (LE), Logic Elements.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2AGZ300FH29C4N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1395 / Stück
Datenblatt ansehen →EP2AGZ300FH29C3N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1925 / Stück
Datenblatt ansehen →EP2AGZ300FH29I3N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1380 / Stück
Datenblatt ansehen →EP2AGZ300FH29I3G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1340 / Stück
Datenblatt ansehen →EP2AGZ300FH29C3G Grenzwerte & elektrische Eigenschaften
| Series | Arria II GZ |
| Manufacturer | Intel (Altera) |
| Logic Elements | 300,000 |
| Number of I/O | 281 |
| Gehäuse | 780-BGA (HBGA, 29 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | 0C to +85C (commercial, speed grade 3) |
| Speed Grade | 3 |
| Process Node | 40 nm |
| Embedded Memory | M9K / M144K block RAM |
| DSP Blocks | Yes (variable-precision DSP) |
| Transceivers | Yes (multi-gigabit) |
| RoHS-Status | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020, where stated) |
EP2AGZ300FH29C3G 780-bga (hbga, 29 mm) Pinbelegungsleitfaden
Pinbelegung für EP2AGZ300FH29C3G (780-bga (hbga, 29 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2AGZ300FH29C3G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2AGZ300FH29C3G ist geeignet für 6 Anwendungs: Telecom Backplane Aggregation, Video Broadcast Processing, DSP-Intensive Test and Measurement, Industrial Protocol Conversion Cards, Aerospace and Defense Data Acquisition, High-Speed Serial Interface Bridging.
Telecom Backplane Aggregation
The EP2AGZ300FH29C3G's 300K logic elements, multi-gigabit transceivers, and 281 user I/O suit telecom backplane aggregation cards that need to bridge multiple lower-rate links into a higher-rate uplink. Placed on a line card with external DDR3 and a backplane connector, the part can run dozens of CPRI/OBSAI links alongside Ethernet MACs. The 780-HBGA package provides sufficient balls for parallel sideband signaling and 10G/40G serial lanes. Commercial temperature (0C-85C) covers central-office and controlled-environment deployments; for outdoor, use the industrial I3/I4 variant.
Empfohlen
Video Broadcast Processing
The EP2AGZ300FH29C3G supports multi-stream SD/HD/3G-SDI video processing with its 300K logic elements, variable-precision DSP blocks, and embedded M9K/M144K block RAM. The multi-gigabit transceivers handle SDI data rates up to 3 Gbps per channel, and the 281 user I/O expose parallel video buses (BT.1120, BT.656) and GPIO for housekeeping. The commercial 0C-85C range is appropriate for studio and broadcast-facility environments. The 780-HBGA provides good thermal dissipation for the 40 nm Arria II GZ silicon during sustained video processing workloads.
Empfohlen
DSP-Intensive Test and Measurement
The EP2AGZ300FH29C3G's variable-precision DSP blocks and 300K logic elements are well matched to test and measurement front-ends that require real-time FFTs, FIR filters, and modulation/demodulation. The fabric's parallel processing capacity lets a single device handle multi-channel signal acquisition alongside the host CPU. Transceivers provide high-speed ADC/DAC data capture at rates up to several Gbps. The 281 user I/O connect to front-panel connectors, LCD/keypad interfaces, and LVDS/HSTL memory buses for high-bandwidth data buffers.
Empfohlen
Industrial Protocol Conversion Cards
Industrial protocol conversion cards (EtherCAT, PROFINET, EtherNet/IP, Modbus TCP gateways) benefit from the EP2AGZ300FH29C3G's high logic density and 281 user I/O. The part can implement multiple industrial Ethernet stacks concurrently while running real-time cycle handling, with the multi-gigabit transceivers providing the upstream Ethernet uplink. The commercial temperature grade suits factory-floor cabinet environments where ambient is controlled. Industrial users needing -40C operation should select the I3/I4 speed-grade variant of the same HBGA package.
Empfohlen
Aerospace and Defense Data Acquisition
The EP2AGZ300FH29C3G suits aerospace and defense data-acquisition front-ends where high logic density, multi-gigabit transceivers, and 281 user I/O are needed for sensor aggregation. The Arria II GZ fabric's 40 nm low-power process balances performance and power, which is critical for size/weight/power-constrained platforms. The commercial temperature grade covers avionics bay and ground-vehicle deployments; for flight-critical or extreme-environment applications, use the industrial I3/I4 speed grade in the same package. The 780-HBGA supports extensive power/ground pinout for noise-sensitive analog front-ends.
Empfohlen
High-Speed Serial Interface Bridging
Bridge cards that convert between high-speed serial standards (PCIe Gen2, Serial RapidIO, 10G Ethernet, XAUI) benefit from the EP2AGZ300FH29C3G's integrated multi-gigabit transceivers and 300K logic elements. The part can host multiple soft MAC/PHY implementations while running protocol conversion glue logic. The 281 user I/O expose parallel sideband buses and configuration/status registers. The 780-HBGA provides good signal integrity for the transceiver channels when the PCB is laid out per the Arria II GZ layout guidelines with controlled-impedance differential pairs and proper grounding.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2AGZ300FH29C3G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2AGZ300FH29C4N | EP2AGZ300FH29C3N | EP2AGZ300FH29I3N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel |
| Package | 780-BGA (HBGA, 29 mm) | 780-BGA (HBGA, 29 mm) - same | 780-BGA (HBGA, 29 mm) - same | 780-BGA (HBGA, 29 mm) - same |
| Logic Elements | 300,000 | 300,000 | 300,000 | 300,000 |
| User I/O | 281 | 281 | 281 | 281 |
| Speed Grade | 3 | 4 | 3 | 3 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm |
| Transceivers | Yes (multi-gigabit) | Yes (multi-gigabit) | Yes (multi-gigabit) | Yes (multi-gigabit) |
Wichtigste Unterscheidungsmerkmale
- 300K logic elements with multi-gigabit transceivers in 780-HBGA (vs. EP2AGZ225FF35C3G)
- Commercial temperature grade for cost-sensitive designs (vs. EP2AGZ300FH29I3N)
- Speed grade 3 (mid-bin) timing for general designs (vs. EP2AGZ300FH29C4N)
Designhinweise
The 780-ball FineLine BGA uses a 1.0 mm ball pitch. Design the PCB with via-in-pad (VIP) or microvia escape structures to route signals out of the array. Keep power and ground balls on dedicated inner layers with stitched via fences around high-speed transceiver channels. Reference the Arria II GZ device pin connection guidelines for unused-pin termination recommendations, which is required to avoid floating-input leakage on the JTAG and configuration pin groups.
Estimated: at 0.85 V core and typical Arria II GZ utilization (~70% logic + 50% DSP + active transceivers), expect a junction-to-ambient thermal rise of 25-35 C/W. The 780-HBGA's exposed internal ground balls provide the primary thermal path; design a continuous top-layer copper pour stitched to the ground balls for heat spreading. Forced-air cooling is recommended for transceiver-heavy designs, especially at industrial temperature grades.
Do not assume that the 'FH29' package code is interchangeable with the 'FF35' package code, even at the same logic density - the FF35 uses a 1152-ball FBGA 35 mm body and has a different ball map. Mixing them will require a PCB redesign. Also note that Quartus II assignments from the older Stratix II GX family are not portable to the Arria II GZ; plan for I/O reassignment and revalidation when migrating designs between families.
Multi-gigabit transceiver channels on the Arria II GZ require controlled-impedance differential pair routing (typically 100 ohm differential) with continuous reference plane on an adjacent layer. Keep trace length matching within the budget defined by the data rate (e.g. <5 ps mismatch for 3.125 Gbps). Use the Arria II GZ transceiver layout guidelines for via stub minimization and AC-coupling capacitor placement.
Compliance-Informationen
RoHS compliant per Intel product page and distributor listings. Lead-free BGA balls. Not AEC-Q100 qualified (this is a commercial/industrial FPGA, not an automotive part).
