EP2AGZ300FH29I3G vs EP2AGZ300FH29I4G Vergleich
Detaillierter Direktvergleich von EP2AGZ300FH29I3G von Intel und EP2AGZ300FH29I4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300FH29I3G | EP2AGZ300FH29I4G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.340,00 | $1.350,00 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Family | Arria II GZ | Arria II GZ (AGZ) |
| Logic Elements (LE) | 300,000 | 300,000 (approx., per family member) |
| Embedded Memory | 18,520 Kbits | — |
| DSP Blocks (18x18 multipliers) | 720 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Number of Transceivers | 24 | — |
| Process Node | 40 nm TSMC | 40 nm TSMC |
| Gehäuse | 780-pin FineLine BGA (FH29), 29x29 mm | — |
| Speed Grade | -3 | I4 |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Operating Voltage (Core) | 0.9 V | — |
| External Memory Interface | DDR3 up to 800 MHz | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Number of I/O | — | 281 |
| Package Type | — | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | — | FH29 (29x29 mm) |
| Betriebstemperaturbereich | — | -40C to +100C (industrial, I-grade) |
| Supply Voltage (Core) | — | 0.9 V (typical) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel |
| Transceivers | — | Embedded multi-gigabit transceivers (per family) |
| DSP Blocks | — | Yes (variable-precision, per family) |
| Block RAM | — | Embedded M9K / M144K blocks |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes (per RoHS) |