EP2AGZ300FH29I3G vs EP2AGZ300FH29I4G 比較
詳細な並列比較: EP2AGZ300FH29I3G メーカー: Intel および EP2AGZ300FH29I4G メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EP2AGZ300FH29I3G | EP2AGZ300FH29I4G |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $1,340.00 | $1,350.00 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Family | Arria II GZ | Arria II GZ (AGZ) |
| Logic Elements (LE) | 300,000 | 300,000 (approx., per family member) |
| Embedded Memory | 18,520 Kbits | — |
| DSP Blocks (18x18 multipliers) | 720 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Number of Transceivers | 24 | — |
| Process Node | 40 nm TSMC | 40 nm TSMC |
| パッケージ | 780-pin FineLine BGA (FH29), 29x29 mm | — |
| Speed Grade | -3 | I4 |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Operating Voltage (Core) | 0.9 V | — |
| External Memory Interface | DDR3 up to 800 MHz | — |
| 実装タイプ | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS ステータス | Compliant | Compliant |
| Number of I/O | — | 281 |
| Package Type | — | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | — | FH29 (29x29 mm) |
| 動作温度範囲 | — | -40C to +100C (industrial, I-grade) |
| Supply Voltage (Core) | — | 0.9 V (typical) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel |
| Transceivers | — | Embedded multi-gigabit transceivers (per family) |
| DSP Blocks | — | Yes (variable-precision, per family) |
| Block RAM | — | Embedded M9K / M144K blocks |
| MSLレベル | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes (per RoHS) |