EP2AGZ300FH29I3N vs EP2AGZ300FH29I4G Vergleich
Detaillierter Direktvergleich von EP2AGZ300FH29I3N von Intel und EP2AGZ300FH29I4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300FH29I3N | EP2AGZ300FH29I4G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.380,00 | $1.350,00 |
| Family | Arria II GZ | Arria II GZ (AGZ) |
| Logic Elements | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | — |
| Embedded Memory | 18,854,912 bits | — |
| User I/O Pins | 281 | — |
| Transceivers | 12 | Embedded multi-gigabit transceivers (per family) |
| Max Transceiver Speed | 6.375 Gbps | — |
| Process Node | 40 nm | 40 nm TSMC |
| Core Voltage | 0.9 V | — |
| Gehäuse | 780-FCBGA (H-BGA, 29x29 mm) | — |
| Speed Grade | I3 | I4 |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| PLLs | 8 (4 general-purpose + 4 transceiver) | — |
| Global Clock Networks | 16 | — |
| RoHS-Status | Compliant | Compliant |
| Lebenszyklusstatus | End of Life (EOL) | — |
| Logic Elements (LE) | — | 300,000 (approx., per family member) |
| Number of I/O | — | 281 |
| Package Type | — | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | — | FH29 (29x29 mm) |
| Betriebstemperaturbereich | — | -40C to +100C (industrial, I-grade) |
| Supply Voltage (Core) | — | 0.9 V (typical) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel |
| DSP Blocks | — | Yes (variable-precision, per family) |
| Block RAM | — | Embedded M9K / M144K blocks |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes (per RoHS) |