EP2AGZ300FH29I4G vs EP2AGZ300FH29I3N Vergleich
Detaillierter Direktvergleich von EP2AGZ300FH29I4G von Intel und EP2AGZ300FH29I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300FH29I4G | EP2AGZ300FH29I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.350,00 | $1.380,00 |
| Family | Arria II GZ (AGZ) | Arria II GZ |
| Logic Elements (LE) | 300,000 (approx., per family member) | — |
| Number of I/O | 281 | — |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | — |
| Betriebstemperaturbereich | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | I3 |
| Process Node | 40 nm TSMC | 40 nm |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | 12 |
| DSP Blocks | Yes (variable-precision, per family) | — |
| Block RAM | Embedded M9K / M144K blocks | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Lead-Free | Yes (per RoHS) | — |
| Logic Elements | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory | — | 18,854,912 bits |
| User I/O Pins | — | 281 |
| Max Transceiver Speed | — | 6.375 Gbps |
| Core Voltage | — | 0.9 V |
| Gehäuse | — | 780-FCBGA (H-BGA, 29x29 mm) |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| PLLs | — | 8 (4 general-purpose + 4 transceiver) |
| Global Clock Networks | — | 16 |
| Lebenszyklusstatus | — | End of Life (EOL) |