EP2AGZ300FH29I4G vs EP2AGZ300FH29I3N 对比
详细并排对比 EP2AGZ300FH29I4G 出自 Intel 和 EP2AGZ300FH29I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGZ300FH29I4G | EP2AGZ300FH29I3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,350.00 | $1,380.00 |
| Family | Arria II GZ (AGZ) | Arria II GZ |
| Logic Elements (LE) | 300,000 (approx., per family member) | — |
| Number of I/O | 281 | — |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | — |
| 工作温度范围 | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | I3 |
| Process Node | 40 nm TSMC | 40 nm |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | 12 |
| DSP Blocks | Yes (variable-precision, per family) | — |
| Block RAM | Embedded M9K / M144K blocks | — |
| RoHS 状态 | Compliant | Compliant |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| Lead-Free | Yes (per RoHS) | — |
| Logic Elements | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory | — | 18,854,912 bits |
| User I/O Pins | — | 281 |
| Max Transceiver Speed | — | 6.375 Gbps |
| Core Voltage | — | 0.9 V |
| 封装 | — | 780-FCBGA (H-BGA, 29x29 mm) |
| 工作温度 | — | -40C to +100C (Industrial) |
| PLLs | — | 8 (4 general-purpose + 4 transceiver) |
| Global Clock Networks | — | 16 |
| 生命周期状态 | — | End of Life (EOL) |