EP2AGZ350FH29C3G vs EP2AGZ350FH29C3N Vergleich
Detaillierter Direktvergleich von EP2AGZ350FH29C3G von Intel und EP2AGZ350FH29C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ350FH29C3G | EP2AGZ350FH29C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.350,00 | $1.920,00 |
| Logic Elements | 350,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Bits) | 16,402,944 | — |
| Embedded Memory Blocks | [DATA_NEEDED: M9K/M144K block count] | — |
| User I/O Pins | 281 | — |
| Transceivers | 24 channels | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) | — |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ | — |
| PLLs | 8 (4 enhanced, 4 fast) | — |
| Global Clocks | 16 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Speed Grade | C3 (commercial, slowest) | C3 |
| Betriebs-Sperrschichttemperatur | 0C to +85C | — |
| Gehäuse | 780-ball FBGA (HBGA, 29x29 mm) | 780-BBGA, FCBGA (FH29) |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Family | — | Arria II GZ |
| Series | — | Arria II GZ |
| Logic Elements (LE) | — | 348,500 |
| Embedded Memory (bits) | — | 21,270,528 |
| Number of LABs/CLBs | — | 13,940 |
| User I/O Count | — | 281 |
| Number of Pins / Terminals | — | 780 |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Voltage - Supply | — | [DATA_NEEDED: core VCC, VCCAUX, VCCD_PLL values] |
| Lead-Free Status | — | Lead free |