EP2AGZ350FH29C3N vs EP2AGZ225FF35I3N Vergleich
Detaillierter Direktvergleich von EP2AGZ350FH29C3N von Intel und EP2AGZ225FF35I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ350FH29C3N | EP2AGZ225FF35I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.920,00 | $2.655,00 |
| Family | Arria II GZ | Arria II GZ |
| Series | Arria II GZ | — |
| Logic Elements (LE) | 348,500 | 224,000 |
| Embedded Memory (bits) | 21,270,528 | — |
| Number of LABs/CLBs | 13,940 | — |
| User I/O Count | 281 | 554 |
| Gehäuse | 780-BBGA, FCBGA (FH29) | 1152-ball FC-FBGA |
| Number of Pins / Terminals | 780 | — |
| Speed Grade | C3 | — |
| Betriebstemperatur | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Voltage - Supply | [DATA_NEEDED: core VCC, VCCAUX, VCCD_PLL values] | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Status | Lead free | — |
| Process Node | 40 nm | — |
| Embedded Memory | — | 14,248,960 bits (approx. 14.25 Mbit) |
| Logic Array Blocks (LABs) | — | 8,960 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Transceiver Channels | — | 24 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Configuration Method | — | SRAM-based (volatile, requires external config device) |
| Maximum User I/O | — | 554 |