EP2AGZ350FH29C3N vs EP2AGZ225FF35I3N Comparación
Comparación detallada lado a lado de EP2AGZ350FH29C3N por Intel y EP2AGZ225FF35I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350FH29C3N | EP2AGZ225FF35I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.920,00 | $2.655,00 |
| Family | Arria II GZ | Arria II GZ |
| Series | Arria II GZ | — |
| Logic Elements (LE) | 348,500 | 224,000 |
| Embedded Memory (bits) | 21,270,528 | — |
| Number of LABs/CLBs | 13,940 | — |
| User I/O Count | 281 | 554 |
| Encapsulado | 780-BBGA, FCBGA (FH29) | 1152-ball FC-FBGA |
| Number of Pins / Terminals | 780 | — |
| Speed Grade | C3 | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Voltage - Supply | [DATA_NEEDED: core VCC, VCCAUX, VCCD_PLL values] | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Status | Lead free | — |
| Process Node | 40 nm | — |
| Embedded Memory | — | 14,248,960 bits (approx. 14.25 Mbit) |
| Logic Array Blocks (LABs) | — | 8,960 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Transceiver Channels | — | 24 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Configuration Method | — | SRAM-based (volatile, requires external config device) |
| Maximum User I/O | — | 554 |