EP2AGZ350FH29I3G vs EP2AGZ350FH29C3G Vergleich

Detaillierter Direktvergleich von EP2AGZ350FH29I3G von Intel und EP2AGZ350FH29C3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ350FH29I3G EP2AGZ350FH29C3G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.450,00 $1.350,00
Family Arria II GZ —
Logic Elements (LE) 350000 (approximately) —
Process Node 40 nm 40 nm TSMC
User I/O Count 281 —
Gehäuse 780-FBGA (FineLine BGA, FH29) 780-ball FBGA (HBGA, 29x29 mm)
Temperature Grade Industrial (-40C to +100C) —
Montageart Surface Mount Surface Mount
Betriebstemperaturbereich -40C to +100C —
Supply Voltage Core [DATA_NEEDED: VCC core voltage] —
Transceivers Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) 24 channels
Memory Interface DDR3 with read/write leveling support (family feature) —
Embedded Multipliers 18x18 hardware multipliers (family feature) —
Configuration Method Serial or parallel via Quartus II (family feature) —
MSL-Level 3 (per BGA package handling guidelines) [DATA_NEEDED: MSL rating]
RoHS-Status Compliant Compliant
Lead Free Yes —
Halogenfrei [DATA_NEEDED: halogen free status] —
Logic Elements — 350,000
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
Embedded Memory (Bits) — 16,402,944
Embedded Memory Blocks — [DATA_NEEDED: M9K/M144K block count]
User I/O Pins — 281
Transceiver Data Rate (max) — 8.5 Gbps
PCI Express Hard IP — 4 x PCIe Gen2 (x1/x4)
External Memory Interface — DDR3 up to 800 MHz, DDR2, QDRII+
PLLs — 8 (4 enhanced, 4 fast)
Global Clocks — 16
Speed Grade — C3 (commercial, slowest)
Betriebs-Sperrschichttemperatur — 0C to +85C
Lead-Free — Yes

Datenblätter & Ressourcen

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