EP2AGZ350FH29I3G vs EP2AGZ350FH29C3G 비교
다음의 상세 나란히 비교: EP2AGZ350FH29I3G 제조: Intel 및 EP2AGZ350FH29C3G 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP2AGZ350FH29I3G | EP2AGZ350FH29C3G |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,450.00 | $1,350.00 |
| Family | Arria II GZ | — |
| Logic Elements (LE) | 350000 (approximately) | — |
| Process Node | 40 nm | 40 nm TSMC |
| User I/O Count | 281 | — |
| 패키지 | 780-FBGA (FineLine BGA, FH29) | 780-ball FBGA (HBGA, 29x29 mm) |
| Temperature Grade | Industrial (-40C to +100C) | — |
| 실장 유형 | Surface Mount | Surface Mount |
| 동작 온도 범위 | -40C to +100C | — |
| Supply Voltage Core | [DATA_NEEDED: VCC core voltage] | — |
| Transceivers | Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) | 24 channels |
| Memory Interface | DDR3 with read/write leveling support (family feature) | — |
| Embedded Multipliers | 18x18 hardware multipliers (family feature) | — |
| Configuration Method | Serial or parallel via Quartus II (family feature) | — |
| MSL 레벨 | 3 (per BGA package handling guidelines) | [DATA_NEEDED: MSL rating] |
| RoHS 상태 | Compliant | Compliant |
| Lead Free | Yes | — |
| 할로겐 프리 | [DATA_NEEDED: halogen free status] | — |
| Logic Elements | — | 350,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (Bits) | — | 16,402,944 |
| Embedded Memory Blocks | — | [DATA_NEEDED: M9K/M144K block count] |
| User I/O Pins | — | 281 |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| PCI Express Hard IP | — | 4 x PCIe Gen2 (x1/x4) |
| External Memory Interface | — | DDR3 up to 800 MHz, DDR2, QDRII+ |
| PLLs | — | 8 (4 enhanced, 4 fast) |
| Global Clocks | — | 16 |
| Speed Grade | — | C3 (commercial, slowest) |
| 동작 접합 온도 | — | 0C to +85C |
| Lead-Free | — | Yes |