EP2AGZ350HF40I2N vs EP2AGZ350HF40C3N Vergleich
Detaillierter Direktvergleich von EP2AGZ350HF40I2N von Intel und EP2AGZ350HF40C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ350HF40I2N | EP2AGZ350HF40C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.380,00 | $2.150,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 350000 | 348,500 |
| Gehäuse | 1517-pin FBGA (HF40) | 1517-ball FCBGA (HF40) |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core Vcc] | — |
| Transceivers | Embedded multi-gigabit transceivers | Up to 24 (per family datasheet) |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Embedded Memory | [DATA_NEEDED: Mbits] | — |
| User I/O Banks | [DATA_NEEDED: bank count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Process Node | [DATA_NEEDED: process node nm] | — |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| Montageart | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| AEC-Q100 | not_applicable | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Logic Array Blocks (LABs) | — | 13,940 |
| Embedded Memory Bits | — | 21,270,528 |
| Embedded Memory Blocks (M9K) | — | [DATA_NEEDED: M9K count] |
| User I/Os | — | 734 |
| Transceiver Data Rate | — | Up to 6.553 Gbps |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm low-power |
| Operating Temperature Grade | — | Commercial (C3) |
| Configuration Mode | — | FPP / AS / JTAG |