EP2AGZ350HF40I2N vs EP2AGZ350HF40C3N Comparación
Comparación detallada lado a lado de EP2AGZ350HF40I2N por Intel y EP2AGZ350HF40C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350HF40I2N | EP2AGZ350HF40C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.380,00 | $2.150,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 350000 | 348,500 |
| Encapsulado | 1517-pin FBGA (HF40) | 1517-ball FCBGA (HF40) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core Vcc] | — |
| Transceivers | Embedded multi-gigabit transceivers | Up to 24 (per family datasheet) |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Embedded Memory | [DATA_NEEDED: Mbits] | — |
| User I/O Banks | [DATA_NEEDED: bank count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Process Node | [DATA_NEEDED: process node nm] | — |
| Estado RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| AEC-Q100 | not_applicable | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Logic Array Blocks (LABs) | — | 13,940 |
| Embedded Memory Bits | — | 21,270,528 |
| Embedded Memory Blocks (M9K) | — | [DATA_NEEDED: M9K count] |
| User I/Os | — | 734 |
| Transceiver Data Rate | — | Up to 6.553 Gbps |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm low-power |
| Operating Temperature Grade | — | Commercial (C3) |
| Configuration Mode | — | FPP / AS / JTAG |