EP2AGZ350HF40I2N vs EP2AGZ350HF40C3N Comparaison
Comparaison détaillée côte à côte de EP2AGZ350HF40I2N par Intel et EP2AGZ350HF40C3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGZ350HF40I2N | EP2AGZ350HF40C3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 380,00 | $2 150,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 350000 | 348,500 |
| Boîtier | 1517-pin FBGA (HF40) | 1517-ball FCBGA (HF40) |
| Température de fonctionnement | -40C to +100C (Industrial) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core Vcc] | — |
| Transceivers | Embedded multi-gigabit transceivers | Up to 24 (per family datasheet) |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Embedded Memory | [DATA_NEEDED: Mbits] | — |
| User I/O Banks | [DATA_NEEDED: bank count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Process Node | [DATA_NEEDED: process node nm] | — |
| Statut RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| AEC-Q100 | not_applicable | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Logic Array Blocks (LABs) | — | 13,940 |
| Embedded Memory Bits | — | 21,270,528 |
| Embedded Memory Blocks (M9K) | — | [DATA_NEEDED: M9K count] |
| User I/Os | — | 734 |
| Transceiver Data Rate | — | Up to 6.553 Gbps |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm low-power |
| Operating Temperature Grade | — | Commercial (C3) |
| Configuration Mode | — | FPP / AS / JTAG |