EP2C35F484I6N vs EP2C35F484C6 Vergleich

Detaillierter Direktvergleich von EP2C35F484I6N von Intel und EP2C35F484C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2C35F484I6N EP2C35F484C6
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $52,10 $57,20
Logic Elements 33,216 —
Logic Array Blocks (LABs) 2,100 —
Total RAM Bits 483,840 bits (483.84 Kbit on-chip) —
Embedded 18x18 Multipliers 35 (Cyclone II family maximum 150) 35
Phase-Locked Loops (PLLs) 4 —
Maximum User I/O Pins 322 (package-dependent; FBGA-484 supports up to 322 user I/O) —
Gehäuse 484-ball FBGA (Fine-Pitch BGA) 484-ball FineLine BGA (FBGA)
Logic Family CMOS —
Core Supply Voltage 1.2 V —
Betriebstemperaturbereich -40C to +85C (industrial) —
Maximum Internal Clock Frequency 402.5 MHz —
Process Node 90 nm TSMC CMOS —
Montageart Surface Mount (BGA) Surface Mount (BGA)
RoHS-Status Compliant Compliant
Configuration Method Serial / Parallel (via Altera/Intel configuration device or JTAG) —
Family — Cyclone II
Logic Elements (LE) — 33,216
Embedded Memory Bits — 483,840 bits (105 M4K blocks x 4 Kbit)
Maximum User I/O — 322
Process Technology — 90 nm low-k CMOS
Core Voltage (VCCINT) — 1.2 V
PLL Analog Supply (VCCA) — 2.5 V
I/O Standards — LVTTL, LVCMOS (1.5/1.8/2.5/3.3 V), SSTL, HSTL, PCI, differential LVDS, RSDS
Speed Grade — -6
Operating Temperature (Commercial) — 0 C to +85 C
PLLs — 4
Global Clock Networks — 16
Configuration Modes — Active Serial (AS), Passive Serial (PS), JTAG
Lead-Free — Yes

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