EP2C50F484C6 vs EP2C35F484C6 Vergleich
Detaillierter Direktvergleich von EP2C50F484C6 von Intel und EP2C35F484C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2C50F484C6 | EP2C35F484C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $110,00 | $57,20 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 50,528 | — |
| Configurable Logic Blocks (CLBs) | 3,158 | — |
| Total RAM Bits | 594,432 bit | — |
| Embedded Memory Blocks | M4K blocks, 4 Kbit each | — |
| Total On-Chip Memory | 8 Mbit | — |
| DSP / Multiplier Blocks | 18-bit x 18-bit hardware multipliers | — |
| PLLs | 4 | 4 |
| Maximum User I/Os | 294 | — |
| Process Technology | 90 nm CMOS | 90 nm low-k CMOS |
| Core Voltage | 1.2 V | — |
| Maximum Internal Frequency | 500 MHz | — |
| Speed Grade | C6 | -6 |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Gehäuse | 484-ball FineLine BGA (F484), 1.0 mm pitch | 484-ball FineLine BGA (FBGA) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) | Active Serial (AS), Passive Serial (PS), JTAG |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LE) | — | 33,216 |
| Embedded Memory Bits | — | 483,840 bits (105 M4K blocks x 4 Kbit) |
| Embedded 18x18 Multipliers | — | 35 |
| Maximum User I/O | — | 322 |
| Core Voltage (VCCINT) | — | 1.2 V |
| PLL Analog Supply (VCCA) | — | 2.5 V |
| I/O Standards | — | LVTTL, LVCMOS (1.5/1.8/2.5/3.3 V), SSTL, HSTL, PCI, differential LVDS, RSDS |
| Operating Temperature (Commercial) | — | 0 C to +85 C |
| Global Clock Networks | — | 16 |
| Lead-Free | — | Yes |