EP2C50F484C6 vs EP2C35F484C6 Comparaison
Comparaison détaillée côte à côte de EP2C50F484C6 par Intel et EP2C35F484C6 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2C50F484C6 | EP2C35F484C6 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $110,00 | $57,20 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 50,528 | — |
| Configurable Logic Blocks (CLBs) | 3,158 | — |
| Total RAM Bits | 594,432 bit | — |
| Embedded Memory Blocks | M4K blocks, 4 Kbit each | — |
| Total On-Chip Memory | 8 Mbit | — |
| DSP / Multiplier Blocks | 18-bit x 18-bit hardware multipliers | — |
| PLLs | 4 | 4 |
| Maximum User I/Os | 294 | — |
| Process Technology | 90 nm CMOS | 90 nm low-k CMOS |
| Core Voltage | 1.2 V | — |
| Maximum Internal Frequency | 500 MHz | — |
| Speed Grade | C6 | -6 |
| Température de fonctionnement | 0C to +85C (commercial) | — |
| Boîtier | 484-ball FineLine BGA (F484), 1.0 mm pitch | 484-ball FineLine BGA (FBGA) |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) | Active Serial (AS), Passive Serial (PS), JTAG |
| Statut RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 33,216 |
| Embedded Memory Bits | — | 483,840 bits (105 M4K blocks x 4 Kbit) |
| Embedded 18x18 Multipliers | — | 35 |
| Maximum User I/O | — | 322 |
| Core Voltage (VCCINT) | — | 1.2 V |
| PLL Analog Supply (VCCA) | — | 2.5 V |
| I/O Standards | — | LVTTL, LVCMOS (1.5/1.8/2.5/3.3 V), SSTL, HSTL, PCI, differential LVDS, RSDS |
| Operating Temperature (Commercial) | — | 0 C to +85 C |
| Global Clock Networks | — | 16 |
| Lead-Free | — | Yes |