EP2C50F484C6 vs EP2C35F484C6 Comparación
Comparación detallada lado a lado de EP2C50F484C6 por Intel y EP2C35F484C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C50F484C6 | EP2C35F484C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $110,00 | $57,20 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 50,528 | — |
| Configurable Logic Blocks (CLBs) | 3,158 | — |
| Total RAM Bits | 594,432 bit | — |
| Embedded Memory Blocks | M4K blocks, 4 Kbit each | — |
| Total On-Chip Memory | 8 Mbit | — |
| DSP / Multiplier Blocks | 18-bit x 18-bit hardware multipliers | — |
| PLLs | 4 | 4 |
| Maximum User I/Os | 294 | — |
| Process Technology | 90 nm CMOS | 90 nm low-k CMOS |
| Core Voltage | 1.2 V | — |
| Maximum Internal Frequency | 500 MHz | — |
| Speed Grade | C6 | -6 |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Encapsulado | 484-ball FineLine BGA (F484), 1.0 mm pitch | 484-ball FineLine BGA (FBGA) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) | Active Serial (AS), Passive Serial (PS), JTAG |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 33,216 |
| Embedded Memory Bits | — | 483,840 bits (105 M4K blocks x 4 Kbit) |
| Embedded 18x18 Multipliers | — | 35 |
| Maximum User I/O | — | 322 |
| Core Voltage (VCCINT) | — | 1.2 V |
| PLL Analog Supply (VCCA) | — | 2.5 V |
| I/O Standards | — | LVTTL, LVCMOS (1.5/1.8/2.5/3.3 V), SSTL, HSTL, PCI, differential LVDS, RSDS |
| Operating Temperature (Commercial) | — | 0 C to +85 C |
| Global Clock Networks | — | 16 |
| Lead-Free | — | Yes |