EP2C70F672C6N vs EP2C70F672C7N Vergleich
Detaillierter Direktvergleich von EP2C70F672C6N von Intel und EP2C70F672C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2C70F672C6N | EP2C70F672C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $260,80 | $195,00 |
| Family | Cyclone II | Cyclone II |
| Series | EP2C70 | — |
| Logic Elements | 68,416 | — |
| Logic Array Blocks (LABs) | 4,276 | — |
| Total RAM Bits | 1,152,000 | — |
| Embedded 18x18 Multipliers | 150 | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 422 | 422 |
| I/O Banks | 8 | — |
| Gehäuse | 672-ball FBGA, 27x27 mm, 1.0 mm pitch | 672-BGA (FBGA-672) |
| Speed Grade | C6 | C7 (slower, lower-power variant) |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Process Technology | 90 nm low-k CMOS, copper interconnect | 90 nm CMOS |
| Configuration Memory | SRAM (volatile) | — |
| Configuration Schemes | AS, AP, PS, JTAG | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Lead-free (per FBGA marking) | Compliant (lead-free FBGA) |
| Logic Elements (LE) | — | 68,416 |
| Total Memory Bits | — | 1,152,000 |
| Embedded Multipliers (18x18) | — | 150 |
| User I/O Banks | — | 8 |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (internal) |
| Supply Voltage - I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |
| Configuration Method | — | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices |