EP2C70F672C7N vs EP2C70F896C6 Vergleich
Detaillierter Direktvergleich von EP2C70F672C7N von Intel und EP2C70F896C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2C70F896C6 - 68K LE Cyclone II FPGA, 896-FBGA | Intel
EP2C70F896C6 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2C70F672C7N | EP2C70F896C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $650,00 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 68,416 | — |
| Total Memory Bits | 1,152,000 | 1,152,000 |
| Embedded Multipliers (18x18) | 150 | — |
| Maximum User I/O | 422 | 622 (per DigiKey listing) |
| User I/O Banks | 8 | — |
| PLLs | 4 | 4 |
| Gehäuse | 672-BGA (FBGA-672) | 896-ball FBGA (FineLine BGA) |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Betriebstemperatur | 0C to +85C (Commercial) | — |
| Speed Grade | C7 (slower, lower-power variant) | 6 |
| Supply Voltage - Core | 1.15 V to 1.25 V (internal) | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant (lead-free FBGA) | [DATA_NEEDED: confirmed RoHS compliance status] |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| Configuration Method | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices | — |
| Logic Elements | — | 68,416 |
| M9K Memory Blocks | — | 622 |
| Embedded 18x18 Multipliers | — | 150 |
| Maximum Operating Frequency | — | 500 MHz |
| Core Voltage | — | 1.2 V |
| Configuration Modes | — | Active Serial, Passive Serial, JTAG |
| Operating Temperature Grade | — | Commercial (0C to +85C) inferred from speed grade suffix |