EP2C8AF256I8N vs EP2C8F256I8N Vergleich

Detaillierter Direktvergleich von EP2C8AF256I8N von Intel und EP2C8F256I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2C8AF256I8N EP2C8F256I8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $21,40 $21,95
Family Cyclone II —
Logic Elements (LE) 8,256 —
Embedded Memory Bits 165,888 bits (162 Kbit RAM) 165,888 bits
Embedded Multipliers (18x18) 36 —
Maximum User I/O Pins 182 —
PLLs 4 2
Global Clocks 16 —
Configuration Elements Embedded SRAM, JTAG, AS, PS —
Core Voltage (VCCINT) 1.2 V —
I/O Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-selectable) —
Process Technology 90 nm CMOS, SRAM-based 90 nm CMOS (SRAM-based)
Gehäuse 256-ball FBGA (FineLine BGA) —
Betriebstemperatur -40C to +100C (Industrial, I suffix) -40C to +85C (industrial)
Montageart Surface Mount (BGA) Surface Mount (BGA)
RoHS-Status Lead-free (per Altera ordering code suffix) Compliant (Pb-free, lead-free reflow compatible)
Speed Grade 8 —
Status Suffix N (lead-free, Pb-free) —
Series — Cyclone II
Logic Elements (LEs) — 8,256
Total RAM Bits — 165,888
Logic Blocks / Logic Cells — 540 (Logic Cells)
User I/O Pins — 182
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Embedded 18x18 Multipliers — Up to 36
Global Clock Networks — 16
Core Supply Voltage — 1.2 V
I/O Supply Voltage — 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Package Type — 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
Configuration Method — SRAM, loaded from external EPCS flash at power-up

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