EP2C8F256CXNAA vs EP2C8F256I8N Vergleich
Detaillierter Direktvergleich von EP2C8F256CXNAA von Intel und EP2C8F256I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2C8F256CXNAA | EP2C8F256I8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11,05 | $21,95 |
| Family | Cyclone II | — |
| Logic Elements | 8,256 | — |
| Embedded Memory (M4K blocks) | 36 blocks (162 Kbits total) | — |
| Embedded 18x18 Multipliers | 18 | Up to 36 |
| PLLs | 4 | 2 |
| Maximum User I/O Pins | 182 | — |
| User Flash Memory | 0 Kbits | — |
| Process Technology | 90 nm | 90 nm CMOS (SRAM-based) |
| Core Supply Voltage | 1.15 V to 1.25 V | 1.2 V |
| I/O Standards | LVCMOS, LVTTL (3.3V, 2.5V, 1.8V, 1.5V) | — |
| Gehäuse | 256-ball FineLine BGA (F256), 1.0 mm pitch, 17x17 mm | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Operating Temperature (Industrial) | -40C to +85C (N suffix) | — |
| RoHS Compliance | Yes (lead-free) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | 3 | — |
| Series | — | Cyclone II |
| Logic Elements (LEs) | — | 8,256 |
| Embedded Memory Bits | — | 165,888 bits |
| Total RAM Bits | — | 165,888 |
| Logic Blocks / Logic Cells | — | 540 (Logic Cells) |
| User I/O Pins | — | 182 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Global Clock Networks | — | 16 |
| I/O Supply Voltage | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Package Type | — | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch |
| Betriebstemperatur | — | -40C to +85C (industrial) |
| Configuration Method | — | SRAM, loaded from external EPCS flash at power-up |
| RoHS-Status | — | Compliant (Pb-free, lead-free reflow compatible) |