EP2C8F256CXNAA vs EP2C8F256I8N 비교

다음의 상세 나란히 비교: EP2C8F256CXNAA 제조: Intel 및 EP2C8F256I8N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 EP2C8F256CXNAA EP2C8F256I8N
브랜드 Intel Intel
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 NRND NRND
재고 상태 In Stock In Stock
단가 (USD) $11.05 $21.95
Family Cyclone II —
Logic Elements 8,256 —
Embedded Memory (M4K blocks) 36 blocks (162 Kbits total) —
Embedded 18x18 Multipliers 18 Up to 36
PLLs 4 2
Maximum User I/O Pins 182 —
User Flash Memory 0 Kbits —
Process Technology 90 nm 90 nm CMOS (SRAM-based)
Core Supply Voltage 1.15 V to 1.25 V 1.2 V
I/O Standards LVCMOS, LVTTL (3.3V, 2.5V, 1.8V, 1.5V) —
패키지 256-ball FineLine BGA (F256), 1.0 mm pitch, 17x17 mm —
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG —
Operating Temperature (Industrial) -40C to +85C (N suffix) —
RoHS Compliance Yes (lead-free) —
실장 유형 Surface Mount (BGA) Surface Mount (BGA)
MSL 레벨 3 —
Series — Cyclone II
Logic Elements (LEs) — 8,256
Embedded Memory Bits — 165,888 bits
Total RAM Bits — 165,888
Logic Blocks / Logic Cells — 540 (Logic Cells)
User I/O Pins — 182
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Global Clock Networks — 16
I/O Supply Voltage — 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Package Type — 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
동작 온도 — -40C to +85C (industrial)
Configuration Method — SRAM, loaded from external EPCS flash at power-up
RoHS 상태 — Compliant (Pb-free, lead-free reflow compatible)

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