EP2S180F1020C3TT vs EP2S180F1020C3 Vergleich
Detaillierter Direktvergleich von EP2S180F1020C3TT von Intel und EP2S180F1020C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2S180F1020C3TT | EP2S180F1020C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $365,00 | $1.280,00 |
| Family | Stratix II | — |
| Series | EP2S180 | Stratix II |
| Logic Elements (LEs) | 179,400 | — |
| Total Memory Bits | 9,383,040 | — |
| User I/O Count | 742 | — |
| Gehäuse | 1020-BBGA (FineLine BGA) | 1020-ball FBGA (flip-chip BGA) |
| Montageart | Surface Mount | Surface Mount |
| Operating Temperature Grade | Commercial / Industrial (per suffix) | — |
| Process Node | 90 nm | 90 nm, all-layer copper SRAM |
| Configuration | SRAM-based, in-system reconfigurable | — |
| Speed Grade | C3 | C3 |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Logic Block Architecture | Adaptive Logic Module (ALM), 8-input fracturable LUT | — |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Logic Array Blocks (LABs) | — | 8,970 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| Core Voltage | — | 1.2 V |
| Betriebstemperatur | — | Commercial (0C to +85C) |
| DSP Blocks | — | Dedicated high-speed multipliers |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |