EP2S180F1020C5 vs EP2S180F1020C3 Vergleich

Detaillierter Direktvergleich von EP2S180F1020C5 von Intel und EP2S180F1020C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2S180F1020C5 EP2S180F1020C3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $3.357,86 $1.280,00
Series Stratix II Stratix II
Family Stratix II —
Logic Elements (LE) 179,400 —
Configurable Logic Blocks (CLBs) 71,760 —
Logic Array Blocks (LABs) 8,970 8,970
Total RAM Bits 9,383,040 —
User I/O Pins 742 —
Gehäuse 1020-BBGA, FCBGA (33 x 33 mm, 1.0 mm pitch) 1020-ball FBGA (flip-chip BGA)
Core Voltage 1.15 V to 1.25 V 1.2 V
Process Technology 90 nm CMOS —
Betriebstemperatur 0 C to +85 C (commercial) Commercial (0C to +85C)
Speed Grade C5 C3
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status [DATA_NEEDED: rohs_status] [DATA_NEEDED: RoHS status]
Configuration Mode JTAG / Passive Serial / Passive Parallel / Active Serial —
Number of Transceivers [DATA_NEEDED: transceiver_count] —
Device Family — EP2S180
Equivalent Logic Elements (LEs) — 179,400
Embedded Memory (RAM bits) — 9,383,040
Maximum User I/Os — 742
Process Node — 90 nm, all-layer copper SRAM
DSP Blocks — Dedicated high-speed multipliers
Memory Interfaces Supported — DDR2 SDRAM, QDRII SRAM, RLDRAM II
I/O Standards — LVDS, LVPECL, SSTL, HSTL
Configuration Method — SRAM-based (volatile, requires boot device)
Development Toolchain — Quartus II / Quartus Prime

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern