EP2S180F1508C3 vs EP2S180F1020C3 Vergleich

Detaillierter Direktvergleich von EP2S180F1508C3 von Intel und EP2S180F1020C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2S180F1508C3 EP2S180F1020C3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Unknown Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $1.280,00
Product Type Field Programmable Gate Array (FPGA) —
Series Stratix II Stratix II
Logic Array Blocks 8,970 LABs —
Gate Count 180,000 gates —
User I/Os 1,170 I/Os —
Versorgungsspannung 1.15 V to 1.25 V —
Gehäuse 1508-BBGA, FCBGA 1020-ball FBGA (flip-chip BGA)
Supplier Device Package 1508-FBGA (30x30 mm) —
Montageart Surface Mount Surface Mount
Terminal Form Ball —
Number of Terminals 1,508 —
Package Code BGA —
Betriebstemperatur [DATA_NEEDED: operating temperature range] Commercial (0C to +85C)
Logic Elements [DATA_NEEDED: logic element count] —
Embedded Memory [DATA_NEEDED: embedded memory capacity] —
Transceivers [DATA_NEEDED: transceiver count and speed] —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 status] —
Device Family — EP2S180
Equivalent Logic Elements (LEs) — 179,400
Logic Array Blocks (LABs) — 8,970
Embedded Memory (RAM bits) — 9,383,040
Maximum User I/Os — 742
Process Node — 90 nm, all-layer copper SRAM
Core Voltage — 1.2 V
Speed Grade — C3
DSP Blocks — Dedicated high-speed multipliers
Memory Interfaces Supported — DDR2 SDRAM, QDRII SRAM, RLDRAM II
I/O Standards — LVDS, LVPECL, SSTL, HSTL
Configuration Method — SRAM-based (volatile, requires boot device)
Development Toolchain — Quartus II / Quartus Prime

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