EP2S180F1508C3 vs EP2S180F1020C3 对比

详细并排对比 EP2S180F1508C3 出自 Intel 和 EP2S180F1020C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2S180F1508C3 EP2S180F1020C3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Unknown Obsolete
库存状态 有库存 有库存
单价(USD) $0.00 $1,280.00
Product Type Field Programmable Gate Array (FPGA) —
Series Stratix II Stratix II
Logic Array Blocks 8,970 LABs —
Gate Count 180,000 gates —
User I/Os 1,170 I/Os —
电源电压 1.15 V to 1.25 V —
封装 1508-BBGA, FCBGA 1020-ball FBGA (flip-chip BGA)
Supplier Device Package 1508-FBGA (30x30 mm) —
安装类型 Surface Mount Surface Mount
Terminal Form Ball —
Number of Terminals 1,508 —
Package Code BGA —
工作温度 [DATA_NEEDED: operating temperature range] Commercial (0C to +85C)
Logic Elements [DATA_NEEDED: logic element count] —
Embedded Memory [DATA_NEEDED: embedded memory capacity] —
Transceivers [DATA_NEEDED: transceiver count and speed] —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 status] —
Device Family — EP2S180
Equivalent Logic Elements (LEs) — 179,400
Logic Array Blocks (LABs) — 8,970
Embedded Memory (RAM bits) — 9,383,040
Maximum User I/Os — 742
Process Node — 90 nm, all-layer copper SRAM
Core Voltage — 1.2 V
Speed Grade — C3
DSP Blocks — Dedicated high-speed multipliers
Memory Interfaces Supported — DDR2 SDRAM, QDRII SRAM, RLDRAM II
I/O Standards — LVDS, LVPECL, SSTL, HSTL
Configuration Method — SRAM-based (volatile, requires boot device)
Development Toolchain — Quartus II / Quartus Prime

数据手册与资源

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