EP2S180F1508C3 vs EP2S180F1020C3 Comparaison
Comparaison détaillée côte à côte de EP2S180F1508C3 par Intel et EP2S180F1020C3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2S180F1508C3 | EP2S180F1020C3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Unknown | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $1 280,00 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Series | Stratix II | Stratix II |
| Logic Array Blocks | 8,970 LABs | — |
| Gate Count | 180,000 gates | — |
| User I/Os | 1,170 I/Os | — |
| Tension d'alimentation | 1.15 V to 1.25 V | — |
| Boîtier | 1508-BBGA, FCBGA | 1020-ball FBGA (flip-chip BGA) |
| Supplier Device Package | 1508-FBGA (30x30 mm) | — |
| Type de montage | Surface Mount | Surface Mount |
| Terminal Form | Ball | — |
| Number of Terminals | 1,508 | — |
| Package Code | BGA | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | Commercial (0C to +85C) |
| Logic Elements | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | — |
| Transceivers | [DATA_NEEDED: transceiver count and speed] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 status] | — |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Logic Array Blocks (LABs) | — | 8,970 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| Process Node | — | 90 nm, all-layer copper SRAM |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C3 |
| DSP Blocks | — | Dedicated high-speed multipliers |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |