EP2S180F1508C3NAA vs EP2S180F1508C4 Vergleich
Detaillierter Direktvergleich von EP2S180F1508C3NAA von Intel und EP2S180F1508C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2S180F1508C3NAA - Stratix II 180K LEs FPGA | Intel | 1508-FBGA
EP2S180F1508C3NAA ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2S180F1508C3NAA | EP2S180F1508C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $285,00 | $0,00 |
| Family | Stratix II | — |
| Logic Elements | 179,400 LEs | — |
| Adaptive Logic Modules (ALMs) | 71,760 ALMs | — |
| Embedded RAM (total) | 9,383,040 bits (M4K + M-RAM) | — |
| M4K RAM Blocks | 930 blocks of 4 Kbits each | — |
| M-RAM Blocks | 9 blocks of 512 Kbits each | — |
| DSP Blocks | 96 blocks (18x18 multipliers) | — |
| 18x18 Embedded Multipliers | 384 | — |
| Transceivers | 12 channels | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Maximum User I/O | 1170 user I/O pins | — |
| Gehäuse | 1508-ball FCBGA | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Speed Grade | -3 (commercial, faster) | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature grade] | [DATA_NEEDED: operating temperature range] |
| Core Voltage | [DATA_NEEDED: VCCINT nominal] | — |
| Montageart | Surface Mount | — |
| RoHS-Status | unknown | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Stratix II |
| Logic Elements/Cells | — | 179,400 cells |
| Total RAM Bits | — | 9,383,040 bits |
| Number of I/O | — | 1,170 I/O |
| Versorgungsspannung | — | 1.15 V to 1.25 V |
| Operating Frequency | — | 711.24 MHz |
| Supplier Device Package | — | 1508-FBGA (40 mm x 40 mm) |
| Gehäuse / Bauform | — | 1508-BBGA, FCBGA |
| Terminal Count | — | 1,508 terminals |
| Terminal Form | — | Ball |
| Packaging | — | Tray |
| Time@Peak Reflow Temperature-Max | — | 30 s |
| Moisture Sensitivity Level | — | MSL 4 (72 hours) |
| Package Shape | — | Square |
| Configuration Technology | — | SRAM-based FPGA |