EP2S180F1508C3NAA vs EP2S180F1508C4 Comparaison
Comparaison détaillée côte à côte de EP2S180F1508C3NAA par Intel et EP2S180F1508C4 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2S180F1508C3NAA - Stratix II 180K LEs FPGA | Intel | 1508-FBGA
EP2S180F1508C3NAA ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2S180F1508C3NAA | EP2S180F1508C4 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $285,00 | $0,00 |
| Family | Stratix II | — |
| Logic Elements | 179,400 LEs | — |
| Adaptive Logic Modules (ALMs) | 71,760 ALMs | — |
| Embedded RAM (total) | 9,383,040 bits (M4K + M-RAM) | — |
| M4K RAM Blocks | 930 blocks of 4 Kbits each | — |
| M-RAM Blocks | 9 blocks of 512 Kbits each | — |
| DSP Blocks | 96 blocks (18x18 multipliers) | — |
| 18x18 Embedded Multipliers | 384 | — |
| Transceivers | 12 channels | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Maximum User I/O | 1170 user I/O pins | — |
| Boîtier | 1508-ball FCBGA | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Speed Grade | -3 (commercial, faster) | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature grade] | [DATA_NEEDED: operating temperature range] |
| Core Voltage | [DATA_NEEDED: VCCINT nominal] | — |
| Type de montage | Surface Mount | — |
| Statut RoHS | unknown | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Stratix II |
| Logic Elements/Cells | — | 179,400 cells |
| Total RAM Bits | — | 9,383,040 bits |
| Number of I/O | — | 1,170 I/O |
| Tension d'alimentation | — | 1.15 V to 1.25 V |
| Operating Frequency | — | 711.24 MHz |
| Supplier Device Package | — | 1508-FBGA (40 mm x 40 mm) |
| Boîtier / Format | — | 1508-BBGA, FCBGA |
| Terminal Count | — | 1,508 terminals |
| Terminal Form | — | Ball |
| Packaging | — | Tray |
| Time@Peak Reflow Temperature-Max | — | 30 s |
| Moisture Sensitivity Level | — | MSL 4 (72 hours) |
| Package Shape | — | Square |
| Configuration Technology | — | SRAM-based FPGA |