EP2S180F1508C3NAA vs EP2S180F1508C4 Comparación
Comparación detallada lado a lado de EP2S180F1508C3NAA por Intel y EP2S180F1508C4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2S180F1508C3NAA - Stratix II 180K LEs FPGA | Intel | 1508-FBGA
EP2S180F1508C3NAA ⚠ Última compraComparación de especificaciones
| Parámetro | EP2S180F1508C3NAA | EP2S180F1508C4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $285,00 | $0,00 |
| Family | Stratix II | — |
| Logic Elements | 179,400 LEs | — |
| Adaptive Logic Modules (ALMs) | 71,760 ALMs | — |
| Embedded RAM (total) | 9,383,040 bits (M4K + M-RAM) | — |
| M4K RAM Blocks | 930 blocks of 4 Kbits each | — |
| M-RAM Blocks | 9 blocks of 512 Kbits each | — |
| DSP Blocks | 96 blocks (18x18 multipliers) | — |
| 18x18 Embedded Multipliers | 384 | — |
| Transceivers | 12 channels | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Maximum User I/O | 1170 user I/O pins | — |
| Encapsulado | 1508-ball FCBGA | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Speed Grade | -3 (commercial, faster) | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature grade] | [DATA_NEEDED: operating temperature range] |
| Core Voltage | [DATA_NEEDED: VCCINT nominal] | — |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | unknown | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Stratix II |
| Logic Elements/Cells | — | 179,400 cells |
| Total RAM Bits | — | 9,383,040 bits |
| Number of I/O | — | 1,170 I/O |
| Tensión de alimentación | — | 1.15 V to 1.25 V |
| Operating Frequency | — | 711.24 MHz |
| Supplier Device Package | — | 1508-FBGA (40 mm x 40 mm) |
| Encapsulado / Carcasa | — | 1508-BBGA, FCBGA |
| Terminal Count | — | 1,508 terminals |
| Terminal Form | — | Ball |
| Packaging | — | Tray |
| Time@Peak Reflow Temperature-Max | — | 30 s |
| Moisture Sensitivity Level | — | MSL 4 (72 hours) |
| Package Shape | — | Square |
| Configuration Technology | — | SRAM-based FPGA |