EP2S180F1508C5 vs EP2S180F1508C4 Vergleich
Detaillierter Direktvergleich von EP2S180F1508C5 von Altera und EP2S180F1508C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Altera
EP2S180F1508C5 - 179K LEs Stratix II FPGA, 1170 I/O, 1508-FBGA | Altera
EP2S180F1508C5 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2S180F1508C5 | EP2S180F1508C4 |
|---|---|---|
| Marke | Altera | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.880,00 | $0,00 |
| Family | Stratix II | — |
| Series | EP2S180 | Stratix II |
| Logic Elements | 179,400 | — |
| Equivalent LEs | ~179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | — |
| Adaptive Logic Modules (ALMs) | 71,760 | — |
| Total RAM Bits | 9,383,040 | 9,383,040 bits |
| Embedded Memory | M512 / M4K / M-RAM blocks | — |
| DSP Blocks | 96 | — |
| User I/O Pins | 1,170 | — |
| Maximum User I/O | 1,170 | — |
| Process Technology | 90 nm, all-layer copper, SRAM | 90 nm |
| Core Voltage | 1.15 V to 1.25 V | — |
| Gehäuse | 1508-FBGA (FCBGA), 40 mm × 40 mm | — |
| Montageart | Surface Mount | — |
| Betriebstemperatur | 0 °C to 85 °C (commercial, C5 speed grade) | [DATA_NEEDED: operating temperature range] |
| Speed Grade | C5 | — |
| Configuration | SRAM, JTAG / Passive Serial / Fast Passive Parallel / Active Serial | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Elements/Cells | — | 179,400 cells |
| Number of I/O | — | 1,170 I/O |
| Versorgungsspannung | — | 1.15 V to 1.25 V |
| Operating Frequency | — | 711.24 MHz |
| Supplier Device Package | — | 1508-FBGA (40 mm x 40 mm) |
| Gehäuse / Bauform | — | 1508-BBGA, FCBGA |
| Terminal Count | — | 1,508 terminals |
| Terminal Form | — | Ball |
| Packaging | — | Tray |
| Time@Peak Reflow Temperature-Max | — | 30 s |
| Moisture Sensitivity Level | — | MSL 4 (72 hours) |
| Package Shape | — | Square |
| Configuration Technology | — | SRAM-based FPGA |