EP2S180F1508C5 vs EP2S180F1508C4 Comparación
Comparación detallada lado a lado de EP2S180F1508C5 por Altera y EP2S180F1508C4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EP2S180F1508C5 - 179K LEs Stratix II FPGA, 1170 I/O, 1508-FBGA | Altera
EP2S180F1508C5 ⚠ Última compraComparación de especificaciones
| Parámetro | EP2S180F1508C5 | EP2S180F1508C4 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.880,00 | $0,00 |
| Family | Stratix II | — |
| Series | EP2S180 | Stratix II |
| Logic Elements | 179,400 | — |
| Equivalent LEs | ~179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | — |
| Adaptive Logic Modules (ALMs) | 71,760 | — |
| Total RAM Bits | 9,383,040 | 9,383,040 bits |
| Embedded Memory | M512 / M4K / M-RAM blocks | — |
| DSP Blocks | 96 | — |
| User I/O Pins | 1,170 | — |
| Maximum User I/O | 1,170 | — |
| Process Technology | 90 nm, all-layer copper, SRAM | 90 nm |
| Core Voltage | 1.15 V to 1.25 V | — |
| Encapsulado | 1508-FBGA (FCBGA), 40 mm × 40 mm | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | 0 °C to 85 °C (commercial, C5 speed grade) | [DATA_NEEDED: operating temperature range] |
| Speed Grade | C5 | — |
| Configuration | SRAM, JTAG / Passive Serial / Fast Passive Parallel / Active Serial | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Elements/Cells | — | 179,400 cells |
| Number of I/O | — | 1,170 I/O |
| Tensión de alimentación | — | 1.15 V to 1.25 V |
| Operating Frequency | — | 711.24 MHz |
| Supplier Device Package | — | 1508-FBGA (40 mm x 40 mm) |
| Encapsulado / Carcasa | — | 1508-BBGA, FCBGA |
| Terminal Count | — | 1,508 terminals |
| Terminal Form | — | Ball |
| Packaging | — | Tray |
| Time@Peak Reflow Temperature-Max | — | 30 s |
| Moisture Sensitivity Level | — | MSL 4 (72 hours) |
| Package Shape | — | Square |
| Configuration Technology | — | SRAM-based FPGA |