EP2S180F1508C5 vs EP2S180F1508C4 Comparaison
Comparaison détaillée côte à côte de EP2S180F1508C5 par Altera et EP2S180F1508C4 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Altera
EP2S180F1508C5 - 179K LEs Stratix II FPGA, 1170 I/O, 1508-FBGA | Altera
EP2S180F1508C5 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2S180F1508C5 | EP2S180F1508C4 |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $4 880,00 | $0,00 |
| Family | Stratix II | — |
| Series | EP2S180 | Stratix II |
| Logic Elements | 179,400 | — |
| Equivalent LEs | ~179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | — |
| Adaptive Logic Modules (ALMs) | 71,760 | — |
| Total RAM Bits | 9,383,040 | 9,383,040 bits |
| Embedded Memory | M512 / M4K / M-RAM blocks | — |
| DSP Blocks | 96 | — |
| User I/O Pins | 1,170 | — |
| Maximum User I/O | 1,170 | — |
| Process Technology | 90 nm, all-layer copper, SRAM | 90 nm |
| Core Voltage | 1.15 V to 1.25 V | — |
| Boîtier | 1508-FBGA (FCBGA), 40 mm × 40 mm | — |
| Type de montage | Surface Mount | — |
| Température de fonctionnement | 0 °C to 85 °C (commercial, C5 speed grade) | [DATA_NEEDED: operating temperature range] |
| Speed Grade | C5 | — |
| Configuration | SRAM, JTAG / Passive Serial / Fast Passive Parallel / Active Serial | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Elements/Cells | — | 179,400 cells |
| Number of I/O | — | 1,170 I/O |
| Tension d'alimentation | — | 1.15 V to 1.25 V |
| Operating Frequency | — | 711.24 MHz |
| Supplier Device Package | — | 1508-FBGA (40 mm x 40 mm) |
| Boîtier / Format | — | 1508-BBGA, FCBGA |
| Terminal Count | — | 1,508 terminals |
| Terminal Form | — | Ball |
| Packaging | — | Tray |
| Time@Peak Reflow Temperature-Max | — | 30 s |
| Moisture Sensitivity Level | — | MSL 4 (72 hours) |
| Package Shape | — | Square |
| Configuration Technology | — | SRAM-based FPGA |