EP2S30F484C5N vs EP2S30F484I4N Vergleich
Detaillierter Direktvergleich von EP2S30F484C5N von Intel und EP2S30F484I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2S30F484C5N | EP2S30F484I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $367,48 | $305,00 |
| Family | Stratix II | Stratix II |
| Logic Elements | 33880 | 33,880 |
| Adaptive Logic Modules (ALMs) | 13552 | — |
| Logic Array Blocks (LABs) | 1694 | — |
| Maximum User I/O Pins | 342 | — |
| Embedded RAM Bits | 1369728 | — |
| DSP Blocks | 24 | — |
| Embedded 18x18 Multipliers | 24 | — |
| PLLs | 12 | Yes (on-chip, refer to datasheet for count) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Speed Grade | C5 | 4 |
| Maximum Internal Frequency | 609.76 MHz | — |
| Gehäuse | 484-Ball FBGA (FBGA-484) | 484-ball FineLine BGA (FBGA) |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch | — |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| MSL-Level | 3 (168 hours) | — |
| RoHS-Status | Compliant | — |
| Embedded Memory | — | 1,369,728 bits |
| User I/O Pins | — | 342 |
| Ball Pitch | — | 1.0 mm |
| Core Voltage | — | 1.2 V (refer to datasheet) |
| Operating Temperature Grade | — | Industrial -40C to +100C |
| Lead-Free / RoHS | — | Yes (N suffix indicates lead-free RoHS) |
| On-Chip DSP Blocks | — | Yes (dedicated 9x9/18x18/36x36 multipliers) |
| Configuration Method | — | Serial/parallel via Quartus II |