EP2S30F484C5N vs EP2S30F484I4N Comparación
Comparación detallada lado a lado de EP2S30F484C5N por Intel y EP2S30F484I4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S30F484C5N | EP2S30F484I4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $367,48 | $305,00 |
| Family | Stratix II | Stratix II |
| Logic Elements | 33880 | 33,880 |
| Adaptive Logic Modules (ALMs) | 13552 | — |
| Logic Array Blocks (LABs) | 1694 | — |
| Maximum User I/O Pins | 342 | — |
| Embedded RAM Bits | 1369728 | — |
| DSP Blocks | 24 | — |
| Embedded 18x18 Multipliers | 24 | — |
| PLLs | 12 | Yes (on-chip, refer to datasheet for count) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Speed Grade | C5 | 4 |
| Maximum Internal Frequency | 609.76 MHz | — |
| Encapsulado | 484-Ball FBGA (FBGA-484) | 484-ball FineLine BGA (FBGA) |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | 3 (168 hours) | — |
| Estado RoHS | Compliant | — |
| Embedded Memory | — | 1,369,728 bits |
| User I/O Pins | — | 342 |
| Ball Pitch | — | 1.0 mm |
| Core Voltage | — | 1.2 V (refer to datasheet) |
| Operating Temperature Grade | — | Industrial -40C to +100C |
| Lead-Free / RoHS | — | Yes (N suffix indicates lead-free RoHS) |
| On-Chip DSP Blocks | — | Yes (dedicated 9x9/18x18/36x36 multipliers) |
| Configuration Method | — | Serial/parallel via Quartus II |