EP2S30F672C5 vs EP2S30F672C3 Vergleich

Detaillierter Direktvergleich von EP2S30F672C5 von Intel und EP2S30F672C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2S30F672C5 EP2S30F672C3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $155,00 $780,00
Family Stratix II —
Logic Elements 33,880 —
Logic Array Blocks (LABs) 1,694 —
Total RAM Bits 1,369,728 1,369,728
Embedded Multipliers (DSP blocks) 12 DSP blocks —
Maximum User I/Os 500 —
Core Voltage 1.2 V —
Maximum Operating Frequency 609.76 MHz —
Process Technology 90 nm CMOS 90 nm CMOS
Gehäuse 672-pin FC-FBGA (flip-chip) —
Speed Grade C5 (moderate-speed bin) -3
Operating Temperature (Commercial) 0C to 85C junction —
Montageart Surface Mount (BGA) Surface Mount
Speichertyp TriMatrix (M512 / M4K / M-RAM) —
RoHS-Status [DATA_NEEDED: confirmed RoHS compliance] Non-compliant (leaded BGA)
Series — Stratix II
Number of Logic Elements — 33,880
Number of Adaptive Logic Modules (ALMs) — 13,560
Total Embedded Memory Bits — 1,369,728
Embedded Memory (M512 / M4K / M-RAM blocks) — M512, M4K, M-RAM TriMatrix
Number of User I/O — 500
Number of Transceivers — [DATA_NEEDED: depends on variant - up to 12]
DSP Blocks — Dedicated 18x18 multipliers
DSP Performance — Up to 156 GMACs
Voltage - Supply — 1.2 V core, multi-rail I/O
Betriebstemperatur — 0C to +85C (Commercial)
Gehäuse / Bauform — 672-BBGA, FCBGA (FineLine BGA)
MSL-Level — [DATA_NEEDED: MSL rating]

Datenblätter & Ressourcen

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