EP2S30F672C5 vs EP2S30F672C3 对比

详细并排对比 EP2S30F672C5 出自 Intel 和 EP2S30F672C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2S30F672C5 EP2S30F672C3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete Obsolete
库存状态 有库存 有库存
单价(USD) $155.00 $780.00
Family Stratix II —
Logic Elements 33,880 —
Logic Array Blocks (LABs) 1,694 —
Total RAM Bits 1,369,728 1,369,728
Embedded Multipliers (DSP blocks) 12 DSP blocks —
Maximum User I/Os 500 —
Core Voltage 1.2 V —
Maximum Operating Frequency 609.76 MHz —
Process Technology 90 nm CMOS 90 nm CMOS
封装 672-pin FC-FBGA (flip-chip) —
Speed Grade C5 (moderate-speed bin) -3
Operating Temperature (Commercial) 0C to 85C junction —
安装类型 Surface Mount (BGA) Surface Mount
存储器类型 TriMatrix (M512 / M4K / M-RAM) —
RoHS 状态 [DATA_NEEDED: confirmed RoHS compliance] Non-compliant (leaded BGA)
Series — Stratix II
Number of Logic Elements — 33,880
Number of Adaptive Logic Modules (ALMs) — 13,560
Total Embedded Memory Bits — 1,369,728
Embedded Memory (M512 / M4K / M-RAM blocks) — M512, M4K, M-RAM TriMatrix
Number of User I/O — 500
Number of Transceivers — [DATA_NEEDED: depends on variant - up to 12]
DSP Blocks — Dedicated 18x18 multipliers
DSP Performance — Up to 156 GMACs
Voltage - Supply — 1.2 V core, multi-rail I/O
工作温度 — 0C to +85C (Commercial)
封装 / 外壳 — 672-BBGA, FCBGA (FineLine BGA)
MSL 等级 — [DATA_NEEDED: MSL rating]

数据手册与资源

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