EP2SGX30CF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel
Teilenummer: EP2SGX30CF780I4 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245 | $24.500,00 |
| 500 | $218 | $109.000,00 |
| 1.000 | $195 | $195.000,00 |
EP2SGX30CF780I4 Übersicht
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and routing interconnects after manufacturing. FPGAs sit between fixed-function ASICs (higher performance, higher NRE cost) and microcontrollers (slower, lower cost) in the programmable logic hierarchy. The Stratix II GX sub-family specifically adds embedded multi-gigabit transceivers (MGTs), positioning it between the original Stratix II (logic-only) and the broader programmable logic taxonomy that ultimately derives from standard-cell ASIC families.
Key features of the EP2SGX30CF780I4 include 33,880 logic elements, embedded transceiver channels supporting high-speed serial I/O, embedded memory blocks (M4K/M-RAM), embedded multipliers (DSP blocks), and 1.2 V core operation. The industrial temperature grade (I4 suffix) supports an operating range of -40 °C to +85 °C. The 780-ball FBGA package measures 29 x 29 mm with a 1.0 mm ball pitch, suitable for high-density PCB designs.
The Stratix II GX architecture uses an adaptive logic module (ALM) approach with a fixed 1.2 V core, distinguishing it from later 65 nm Stratix III/IV families. Embedded transceivers can support multi-gigabit serial protocols, and the device integrates dedicated hardware for DDR/DDR2 memory interfaces. The 90 nm process technology represents an earlier node generation relative to current 28 nm/14 nm Intel Cyclone and Stratix families.
Typical applications include high-speed serial interface bridging, telecom line cards, industrial imaging and video processing, military radar prototyping, and embedded DSP pipelines. The combination of logic density, transceiver capability, and the industrial temperature grade makes this device a common choice for legacy long-life-cycle systems where re-design costs are prohibitive.
When designing with this device, ensure the Quartus II design tool (or a compatible modern equivalent that still supports the legacy Stratix II family) is used. Power sequencing on the 1.2 V core rail must follow the Stratix II GX handbook guidance, and the FBGA-780 footprint requires multi-layer PCB stack-up with controlled-impedance routing for transceiver channels.
This page synthesizes distributor pricing, drop-in same-family alternatives, application guidance, and design notes not collated in the original manufacturer datasheet.
Drop-in-Alternativen für EP2SGX30CF780I4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2SGX30CF780I4 (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements, Operating Temperature, RoHS Status, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2SGX30CF780I4N
✅ Drop-In✓ Auf Lager
$138 / Stück
Datenblatt ansehen →EP2SGX30CF780I3
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$171 / Stück
Datenblatt ansehen →EP2SGX30CF780C7
✅ Drop-In✓ Auf Lager
$171 / Stück
Datenblatt ansehen →EP2SGX30CF780C6
✅ Drop-In✓ Auf Lager
$165 / Stück
Datenblatt ansehen →EP2SGX30CF780C5N
✅ Drop-In✓ Auf Lager
$160 / Stück
Datenblatt ansehen →EP2SGX30CF780C4N
✅ Drop-In✓ Auf Lager
$379 / Stück
Datenblatt ansehen →EP2SGX30CF780I4 Grenzwerte & elektrische Eigenschaften
| Family | Stratix II GX |
| Logic Elements | 33,880 |
| Logic Cells / CLBs | 33,880 |
| Process Technology | 90 nm CMOS |
| Maximum Internal Frequency | 622.08 MHz |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V |
| Gehäuse | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) |
| Operating Temperature Grade | Industrial (-40 °C to +85 °C) |
| Terminal Form | Ball (BGA) |
| Package Code | BGA (FineLine FBGA) |
| Number of Pins / Balls | 780 |
| Logic Family | CMOS |
EP2SGX30CF780I4 bga (fineline fbga) Pinbelegungsleitfaden
Pinbelegung für EP2SGX30CF780I4 (bga (fineline fbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2SGX30CF780I4.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2SGX30CF780I4 ist geeignet für 6 Anwendungs: Telecom Line-Card Bridging, High-Speed Serial Protocol Bridge, Industrial Video Processing, Military and Aerospace Radar Prototyping, Embedded DSP Pipelines, Legacy Long-Life-Cycle System Sustainment.
Telecom Line-Card Bridging
The EP2SGX30CF780I4's 33,880 logic elements plus embedded multi-gigabit transceivers make it a strong fit for telecom line-card bridging applications. The 90 nm Stratix II GX architecture integrates dedicated SERDES channels that simplify PHY-layer design for protocols such as SONET/SDH, Ethernet over backplane, and proprietary chip-to-chip links at gigabit rates. With industrial temperature grade (-40 °C to +85 °C), it can be deployed in central-office and outdoor-cabinet equipment where commercial-grade parts would fail. The 1.15-1.25 V core voltage enables moderate dynamic power at full toggle rate. Compared with newer 28 nm Cyclone V parts, the Stratix II GX trades process node for higher per-channel transceiver integration in a single die.
Empfohlen
High-Speed Serial Protocol Bridge
Engineers commonly deploy the EP2SGX30CF780I4 as a high-speed serial protocol bridge, converting between PCI Express, Serial RapidIO, XAUI, and custom gigabit serial interfaces. The device's integrated transceivers support multi-gigabit data rates with on-chip clock-and-data recovery, eliminating external PHY chips. The 33,880 logic elements provide sufficient fabric for protocol state machines, buffer management, and packet processing. Compared with using a microcontroller + external PHY, the FPGA approach reduces BOM count and latency while adding flexibility for late-stage protocol revisions. Industrial temperature grade enables deployment in factory automation and ruggedized embedded systems.
Empfohlen
Industrial Video Processing
The EP2SGX30CF780I4 fits well into industrial video processing applications such as machine-vision frame grabbers, multi-channel video encoding, and image-pipeline pre-processing. Its embedded multipliers implement real-time FIR filters, scaling, and color-space conversion at full HD frame rates. The 33,880 logic elements handle pixel-pipeline state machines and memory arbitration between camera input and DDR/DDR2 buffers. The industrial temperature rating is critical for factory-floor deployments where ambient temperatures exceed consumer-grade limits. Quartus II IP cores for video processing (DDR2 controllers, video sync detectors) shorten development time considerably. Newer parts at 28 nm offer higher density, but the Stratix II GX remains preferred where long-lifecycle support outweighs raw performance.
Empfohlen
Military and Aerospace Radar Prototyping
Defense and aerospace engineers historically chose the EP2SGX30CF780I4 for radar-prototype signal-processing channels because of its combination of transceiver integration, industrial temperature range, and long-life-cycle Altera/Intel FPGA support. The 33,880 logic elements implement FFT pipelines, pulse compression, and beamforming weight calculations. Embedded multipliers accelerate complex-MAC operations for Doppler filtering. While not formally MIL-STD-883 qualified unless specifically screened, the industrial-grade part is widely used in COTS-based defense programs. Designers should pair the FPGA with screened SDRAM and validate thermal margins at the system level.
Empfohlen
Embedded DSP Pipelines
For embedded DSP pipelines such as software-defined-radio baseband, audio beamforming, and sensor-array processing, the EP2SGX30CF780I4 delivers a balanced mix of logic density and DSP block count. Each Stratix II GX DSP block implements configurable 9x9, 18x18, and 36x36 multipliers with optional accumulators and pipeline stages, enabling efficient FFT, FIR, and matrix-multiply implementations. The 33,880 logic cells provide the surrounding control logic and register files. At 1.15-1.25 V core, power consumption is moderate; thermal management is straightforward with standard airflow. Designers should analyze DSP utilization with the Quartus II DSP Builder or hard IP cores.
Empfohlen
Legacy Long-Life-Cycle System Sustainment
The EP2SGX30CF780I4 remains in service for legacy long-life-cycle systems where re-design is cost-prohibitive - examples include industrial controllers, certified medical subsystems, and rail signaling equipment originally certified with this exact part. The 780-ball FBGA footprint, Quartus II tool flow, and IP cores are stable and reproducible. Engineers designing replacement boards for these systems must match the original pinout exactly, which the same-family EP2SGX30 variants (C5/C6/C7/I4N) enable without PCB rework. For new designs not constrained to this footprint, evaluate current Stratix 10 or Cyclone V parts for better performance-per-watt. The Altera/Intel long-term purchase program can extend supply for end-of-life scenarios.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2SGX30CF780I4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2SGX30CF780I4N | EP2SGX30CF780I3 | EP2SGX30CF780C7 | EP2SGX30CF780C6 | EP2SGX30CF780C5N | EP2SGX30CF780C4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-ball FBGA (29x29mm, 1.0mm pitch) | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Speed Grade | I4 (fastest) | I4 (fastest) | I3 (-1 bin) | C7 | C6 | C5 | C4 |
| Temperature Grade | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade at fastest speed bin (vs. EP2SGX30CF780C7)
- Lead-free terminal finish variant available with identical die (vs. EP2SGX30CF780I4N)
- Embedded multi-gigabit transceivers integrated (vs. EP2S130F1020C5 (non-GX Stratix II))
Designhinweise
Stratix II GX power sequencing must follow the Stratix II GX handbook: VCCINT (1.2 V) must ramp before or simultaneously with VCCPD (3.3 V); reverse sequencing can damage internal ESD structures. Use a dedicated power sequencer IC or carefully designed RC network. For EP2SGX30CF780I4, inrush current during configuration can exceed 1 A; ensure bulk capacitance meets the Quartus II PowerPlay early-power-estimate recommendation.
The 780-ball FBGA has a moderate theta-JA (approximately 12-15 C/W with standard 8-layer PCB and adequate airflow). At full toggle rate, the EP2SGX30CF780I4 can dissipate 5-8 W. Industrial applications at +85 C ambient need either 200 LFM airflow or a heat-spreader attached to the package top with thermal interface material. Always verify with Quartus II PowerPlay thermal analysis.
The FBGA-780 1.0 mm pitch footprint requires 0.5 mm pad diameter with microvia-in-pad construction for reliable assembly. Use ENIG or OSP surface finish; avoid HASL on this fine pitch. Decoupling: place 0.1 uF and 0.01 uF capacitors within 2 mm of every VCCINT and VCCPD ball group; add bulk 47-100 uF tantalum or polymer capacitors near the package edges. Transceiver channels require 100-ohm differential controlled-impedance routing on the top or stripline layers with continuous reference plane.
Multi-gigabit transceiver channels on the EP2SGX30CF780I4 require matched-length differential pairs within 0.5 mm tolerance; AC-coupling capacitors are mandatory on transmit outputs per the Stratix II GX handbook. Reference the Altera Transceiver Design Guide for eye-diagram compliance and pre-emphasis / equalization settings. Without proper channel layout, BER degrades rapidly at gigabit rates.
Do not attempt to migrate a Stratix II GX design to Cyclone V or Stratix V without a full Quartus II-to-Quartus Prime re-fit; ball maps and IP cores are incompatible. Verify the JTAG chain configuration during bring-up - configuration failures often look like silicon failures but are actually missing or reversed TMS/TCK signals. Finally, ensure the configuration device (EPCS or compatible flash) is sized for the compressed bitstream; use Quartus II Convert Programming File tool to generate the correct .pof/.jic.
Compliance-Informationen
RoHS, REACH, and lead-free status were not explicitly stated in the verified web data. The 'N' suffix on EP2SGX30CF780I4N indicates lead-free per standard Altera/Intel naming; the I4 (without N) likely uses SnPb finish. Confirm with distributor CoC at order time. AEC-Q100 is not applicable for FPGAs of this complexity (FPGAs do not undergo AEC-Q100 automotive qualification).
