EP2SGX30CF780I4N vs EP2SGX30CF780I3 Vergleich
Detaillierter Direktvergleich von EP2SGX30CF780I4N von Intel und EP2SGX30CF780I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX30CF780I4N | EP2SGX30CF780I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $138,00 | $171,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | — |
| Logic Cells / CLBs | 33,880 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Maximum Internal Frequency | 622.08 MHz | 622.08 MHz |
| Embedded Transceivers | 4 channels (up to 3.125 Gbps at C4) | — |
| Gehäuse | 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Pin / Terminal Count | 780 | — |
| Betriebstemperatur | -40C to +85C (Industrial) | -40 °C to +85 °C (Industrial) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-Free | Yes | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status not confirmed in supplied data] |
| Speichertyp | Embedded SRAM, external DDR/DDR2/QDR support | — |
| Configuration | JTAG / passive serial / fast passive parallel | — |
| Logic Cells | — | 33,880 |
| Logic Array Blocks (LABs) | — | 33,880 |
| Number of User I/O Pins | — | 361 |
| Core Voltage | — | 1.2 V |
| Transceivers | — | Embedded multi-gigabit transceivers (6.375 Gbps) |
| Terminal Pitch | — | 1.0 mm |
| Temperature Grade Suffix | — | I3 (Industrial) |
| Total Terminals | — | 780 |
| Package Code | — | BGA, square shape |