EP2SGX30CF780I4N vs EP2SGX30CF780I3 Comparaison
Comparaison détaillée côte à côte de EP2SGX30CF780I4N par Intel et EP2SGX30CF780I3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2SGX30CF780I4N | EP2SGX30CF780I3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $138,00 | $171,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | — |
| Logic Cells / CLBs | 33,880 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Maximum Internal Frequency | 622.08 MHz | 622.08 MHz |
| Embedded Transceivers | 4 channels (up to 3.125 Gbps at C4) | — |
| Boîtier | 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Pin / Terminal Count | 780 | — |
| Température de fonctionnement | -40C to +85C (Industrial) | -40 °C to +85 °C (Industrial) |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-Free | Yes | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status not confirmed in supplied data] |
| Type de mémoire | Embedded SRAM, external DDR/DDR2/QDR support | — |
| Configuration | JTAG / passive serial / fast passive parallel | — |
| Logic Cells | — | 33,880 |
| Logic Array Blocks (LABs) | — | 33,880 |
| Number of User I/O Pins | — | 361 |
| Core Voltage | — | 1.2 V |
| Transceivers | — | Embedded multi-gigabit transceivers (6.375 Gbps) |
| Terminal Pitch | — | 1.0 mm |
| Temperature Grade Suffix | — | I3 (Industrial) |
| Total Terminals | — | 780 |
| Package Code | — | BGA, square shape |