EP2SGX30DF780C4 vs EP2SGX30DF780C5 Vergleich
Detaillierter Direktvergleich von EP2SGX30DF780C4 von Intel und EP2SGX30DF780C5 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX30DF780C4 | EP2SGX30DF780C5 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $112,00 | $384,62 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | — |
| Logic Cells | 33,880 | — |
| Number of LABs / CLBs | 1,694 | — |
| Total Number of I/Os | 361 | — |
| Maximum Operating Frequency | 717 MHz | — |
| Number of Transceivers | 20 (embedded multi-gigabit) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Gehäuse | FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) | 780-ball FBGA (FC-FBGA), 29 x 29 mm, 1 mm pitch |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Operating Temperature Grade | Commercial (C4) | — |
| Programmable Terminals | BGA ball grid (780 terminals) | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant (per manufacturer product page) | [DATA_NEEDED: RoHS compliance status from verified data] |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 33,880 |
| LABs/CLBs | — | 1694 |
| Total RAM Bits | — | 1,369,728 bits |
| Number of Logic Cells | — | 33,880 cells |
| Maximum User I/Os | — | 361 |
| Transceiver Channels | — | 4 (up to 3.125 Gbps each) |
| Internal Frequency (max) | — | 609.76 MHz |
| Betriebstemperatur | — | -40C to +85C (commercial) |
| Speed Grade | — | -5 |