EP2SGX30DF780C4 vs EP2SGX30DF780C5 Comparación
Comparación detallada lado a lado de EP2SGX30DF780C4 por Intel y EP2SGX30DF780C5 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX30DF780C4 | EP2SGX30DF780C5 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Fin de vida | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $112,00 | $384,62 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | — |
| Logic Cells | 33,880 | — |
| Number of LABs / CLBs | 1,694 | — |
| Total Number of I/Os | 361 | — |
| Maximum Operating Frequency | 717 MHz | — |
| Number of Transceivers | 20 (embedded multi-gigabit) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Encapsulado | FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) | 780-ball FBGA (FC-FBGA), 29 x 29 mm, 1 mm pitch |
| Tipo de montaje | Surface Mount | Surface Mount |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Operating Temperature Grade | Commercial (C4) | — |
| Programmable Terminals | BGA ball grid (780 terminals) | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | Compliant (per manufacturer product page) | [DATA_NEEDED: RoHS compliance status from verified data] |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 33,880 |
| LABs/CLBs | — | 1694 |
| Total RAM Bits | — | 1,369,728 bits |
| Number of Logic Cells | — | 33,880 cells |
| Maximum User I/Os | — | 361 |
| Transceiver Channels | — | 4 (up to 3.125 Gbps each) |
| Internal Frequency (max) | — | 609.76 MHz |
| Temperatura de funcionamiento | — | -40C to +85C (commercial) |
| Speed Grade | — | -5 |